EMK x NEPCON KOREA 2027

Description

LED PACKAGING EXPO is a premier international trade exhibition dedicated to the manufacturing equipment and materials required for LED, Backlight Units (BLU), and electronic components. Held as part of the Electronics Manufacturing Korea (EMK) mega-event, it showcases the latest advancements in surface mount technology, semiconductor packaging, and high-precision electronic assembly. The event serves as a vital platform for industry professionals to explore cutting-edge thermal management solutions, inspection systems, and automated production technologies that drive the future of display and lighting sectors.

Exhibits

LED manufacturing equipment, BLU components, dispensers, curing machines, inspection tools, and thermal management materials.

Activities

Technical seminars on LED trends, B2B matchmaking sessions, product demonstrations, and networking forums for electronics engineers.

Speakers

Industry experts from leading semiconductor firms and electronics manufacturing research institutes discussing micro-LED and packaging trends.

Demos

Live demonstrations of high-speed pick-and-place machines, automated optical inspection (AOI), and advanced soldering systems.

Accessibility

The event typically takes place at COEX in Seoul. From Incheon International Airport, take the Airport Limousine Bus (6006) or the AREX train to Seoul Station, transferring to Subway Line 2 to Samseong Station.

Exhibitor Count

400

Expected Attendance

15000

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