PWB EXPO - PRINTED WIRING BOARDS EXPO JAPAN - TOKYO 2027

Description

PWB EXPO is a premier international exhibition held in Tokyo, Japan, dedicated to the latest advancements in Printed Wiring Boards (PWBs) and Printed Circuit Boards (PCBs). As a core component of NEPCON JAPAN, the event showcases a comprehensive range of PCB materials, design and development services, and cutting-edge digital design tools. It serves as a vital platform for electronics manufacturers, automotive engineers, and industrial designers to source innovative components and explore the future of electronic interconnection technologies.

Exhibits

Rigid, flexible, and multilayer PCBs, build-up PWBs, semiconductor packaging materials, design software, and CAD/CAM tools.

Activities

Technical conferences, networking seminars, business matching sessions, and keynote presentations on next-generation electronics.

Speakers

Industry leaders from top electronics firms, academic researchers in materials science, and technical experts from RX Japan.

Demos

Live demonstrations of high-speed circuit design software and hands-on displays of ultra-thin and high-density board materials.

Accessibility

The event is held at Tokyo Big Sight. From Narita Airport, take the Airport Limousine Bus or the Narita Express to Tokyo Station, then the Yurikamome Line to Tokyo Big Sight Station.

Exhibitor Count

1700

Expected Attendance

75000

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