IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027

Description

IC & SENSOR PACKAGING EXPO JAPAN is Asia's premier exhibition dedicated to the final manufacturing processes of integrated circuits and sensors. As a core component of NEPCON JAPAN, the event showcases cutting-edge assembly equipment, advanced packaging materials, and sophisticated analysis/simulation software. It serves as a vital hub for semiconductor manufacturers and electronics designers to discover the latest innovations in 2.5D/3D packaging, fan-out wafer-level packaging, and power device assembly. The expo provides a high-level networking platform for industry professionals to address technical challenges in miniaturization and high-performance electronic manufacturing.

Exhibits

Advanced assembly equipment, bonding tools, packaging materials, molding resins, plating chemicals, and analysis/simulation software for IC and sensor manufacturing.

Activities

Technical conferences, keynote sessions by industry leaders, product demonstrations, and business matchmaking opportunities across the semiconductor supply chain.

Speakers

Executive leaders from top semiconductor firms, research scientists from academic institutions, and technical experts from leading equipment manufacturers.

Demos

Live demonstrations of high-precision wire bonding, flip-chip assembly, wafer-level packaging processes, and automated inspection systems.

Accessibility

The event is typically held at Tokyo Big Sight. From Haneda Airport, take the Airport Limousine Bus or the Tokyo Monorail to Tennozu Isle and transfer to the Rinkai Line for Kokusai-Tenjijo Station.

Exhibitor Count

1700

Expected Attendance

75000

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