FINE PROCESS TECHNOLOGY EXPO JAPAN - OSAKA1 2027

Description

FINE PROCESS TECHNOLOGY EXPO is a specialized international exhibition focused on high-precision processing technologies essential for electronics manufacturing. As part of the prestigious NEPCON JAPAN series, it showcases cutting-edge advancements in molding, cutting, press work, etching, and ultra-precision machining. The event serves as a vital platform for engineers and manufacturers to discover the latest tools and techniques required for the miniaturization and high-performance demands of modern electronic devices, including smartphones, automotive electronics, and wearable technology.

Exhibits

Exhibitors showcase ultra-precision press work, fine etching, laser processing, micro-molding, precision cutting, and advanced surface treatment technologies for electronic components.

Activities

Technical conferences, networking sessions between manufacturers and solution providers, and specialized seminars on the future of micro-processing in the electronics industry.

Speakers

Industry experts from leading electronics firms, academic researchers in precision engineering, and technical directors from top manufacturing equipment companies.

Demos

Live demonstrations of high-speed precision stamping, micro-laser drilling, and real-time quality inspection systems for microscopic electronic parts.

Accessibility

The event typically takes place at Tokyo Big Sight. From Narita Airport, take the Airport Limousine Bus or the Narita Express to Tokyo Station, then the Yurikamome Line to Ariake Station.

Exhibitor Count

1700

Expected Attendance

75000

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