IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2026

Description

IC & SENSOR PACKAGING EXPO is Asia's leading exhibition dedicated to IC final manufacturing, showcasing advanced equipment, materials, and services for semiconductor packaging. Part of the prestigious NEPCON JAPAN series, the event serves as a vital hub for engineers and manufacturers to discover the latest innovations in assembly equipment, packaging materials, and analysis/simulation software. It focuses on the evolving needs of the semiconductor industry, including miniaturization, high-density mounting, and the integration of advanced sensor technologies.

Exhibits

Bonding equipment, molding machines, plating equipment, packaging materials (resins, lead frames), inspection tools, and simulation software for IC and sensor manufacturing.

Activities

Technical seminars on advanced packaging, networking sessions for semiconductor engineers, and business matchmaking between global suppliers and Japanese manufacturers.

Speakers

Industry leaders from top semiconductor firms, academic researchers specializing in microelectronics, and technical experts from major equipment manufacturers.

Demos

Live demonstrations of high-precision wire bonding, automated inspection systems, and advanced thermal management solutions for next-generation sensors.

Accessibility

The event is typically held at Makuhari Messe. From Narita Airport, take the Keisei Bus to Makuhari Messe (40 mins). From Haneda Airport, take the Airport Limousine Bus (50 mins). By train, take the JR Keiyo Line to Kaihimmakuhari Station, followed by a 5-minute walk.

Exhibitor Count

1500

Expected Attendance

50000

You must be logged in to comment on this event.