FINE PROCESS TECHNOLOGY EXPO JAPAN - CHIBA 2026

Description

FINE PROCESS TECHNOLOGY EXPO is a specialized international exhibition focused on high-precision processing technologies essential for electronics manufacturing. As part of the prestigious NEPCON JAPAN umbrella, the event showcases cutting-edge advancements in molding, cutting, press work, etching, and other fine-scale fabrication techniques. It serves as a vital platform for engineers and manufacturers to discover the latest equipment and materials required to produce smaller, more efficient electronic components and devices.

Exhibits

Precision molding, laser cutting, micro-machining, etching, press work, plating, and ultra-precision surface treatment technologies for electronics.

Activities

Technical conferences, networking sessions, product demonstrations, and business matchmaking between technology providers and electronics manufacturers.

Speakers

Industry leaders from top electronics firms, academic researchers specializing in micro-fabrication, and technical experts from leading machinery manufacturers.

Demos

Live demonstrations of high-speed precision cutting machines, micro-molding equipment, and automated etching systems in a factory-simulated environment.

Accessibility

The event is held at Port Messe Nagoya. From Chubu Centrair International Airport, take the Meitetsu Line to Nagoya Station, then transfer to the Aonami Line and exit at Kinjo-futo Station. The venue is a 5-minute walk from the station.

Exhibitor Count

700

Expected Attendance

25000

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