IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2027

Description

The IC Packaging Fair is a specialized exhibition focused on the semiconductor packaging and testing industry. Held as a core component of the NEPCON series, it showcases the latest innovations in laminating technology, soldering equipment, and comprehensive test and measurement solutions. The event serves as a critical platform for professionals in the electronics manufacturing industry to explore advanced PCBA section testing, laboratory measurement tools, and finished product assembly technologies. It facilitates technical exchange and business matchmaking for the global semiconductor supply chain.

Exhibits

Laminating equipment, soldering systems, semiconductor packaging materials, PCBA testing tools, and laboratory measurement instruments.

Activities

Technical seminars on semiconductor trends, business matchmaking sessions, and industrial networking forums for electronics manufacturers.

Speakers

Industry experts from leading semiconductor firms, academic researchers in microelectronics, and technical directors from equipment manufacturers.

Demos

Live demonstrations of high-precision soldering robots, automated optical inspection (AOI) systems, and advanced packaging machinery.

Accessibility

The event is typically held at the Shenzhen World Exhibition & Convention Center. Accessible via Shenzhen Bao'an International Airport (SZX). Take Metro Line 20 directly to the venue.

Exhibitor Count

500

Expected Attendance

30000

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