IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA 2026

Description

The IC Packaging Fair is a specialized trade exhibition held concurrently with NEPCON Asia, focusing on the latest advancements in semiconductor packaging and testing technologies. It serves as a vital platform for professionals in the electronics manufacturing industry to explore cutting-edge solutions in laminating, soldering, and high-precision measurement. The event highlights the shift towards advanced packaging techniques such as SiP (System-in-Package) and 3D packaging, catering to the growing demands of the consumer electronics, automotive, and telecommunications sectors.

Exhibits

Laminating technology, soldering equipment, PCBA test and measurement tools, laboratory testing devices, and finished product assembly machinery.

Activities

Technical seminars on semiconductor trends, business matchmaking sessions, industry forums on advanced packaging, and networking banquets.

Speakers

Industry experts from leading semiconductor firms, academic researchers in microelectronics, and senior technical consultants from RX China.

Demos

Live demonstrations of high-speed automated soldering lines, precision testing of integrated circuits, and advanced laminating processes.

Accessibility

Located at the Shenzhen World Exhibition & Convention Center. Accessible from Shenzhen Bao'an International Airport via Metro Line 20 or a 15-minute taxi ride. Shuttle buses are also available.

Exhibitor Count

600

Expected Attendance

60000

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