IC PACKAGING FAIR 2026

Description

The IC Packaging Fair is a premier international trade event held concurrently with NEPCON Asia, focusing on the semiconductor packaging and testing industry. The exhibition showcases the latest advancements in laminating technology, soldering equipment, and sophisticated test and measurement tools for PCBA and finished product assembly. It serves as a vital platform for industry professionals to explore cutting-edge semiconductor manufacturing solutions, back-end packaging innovations, and quality control systems, facilitating technical exchange and business partnerships within the global electronics manufacturing supply chain.

Exhibits

Laminating technology, soldering equipment, PCBA test and measurement tools, laboratory testing instruments, and finished product assembly equipment.

Activities

Technical seminars on semiconductor packaging, business matchmaking sessions, industry forums, and networking events for electronics manufacturing professionals.

Speakers

Industry experts from leading semiconductor firms, technical engineers, and researchers discussing trends in IC packaging and smart manufacturing.

Demos

Live demonstrations of automated soldering robots, high-precision testing systems, and advanced IC packaging production lines.

Accessibility

Located at the Shenzhen World Exhibition & Convention Center. From Shenzhen Bao'an International Airport, take Metro Line 20 directly to the venue or a 15-minute taxi ride.

Exhibitor Count

600

Expected Attendance

60000

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