SWOP 2026

Description

SWOP (Shanghai World of Packaging) is a premier international trade fair for the processing and packaging industry. As a member of the interpack alliance, it serves as a comprehensive platform covering the entire value chain, including food, beverages, confectionery, bakery, pharmaceuticals, cosmetics, non-food consumer goods, and industrial goods. The exhibition focuses on emerging trends such as lightweight packaging, personalization, sustainable materials, and smart manufacturing technologies, providing a vital hub for innovation and business networking in the Asia-Pacific region.

Exhibits

Packaging machinery, processing equipment, primary and secondary packaging materials, logistics packaging, and smart packaging solutions for food, pharma, and cosmetics sectors.

Activities

Themed zones like 'Green Power' and 'Smart Packaging', technical forums, business matching sessions, and the 'Save Food' initiative focusing on reducing food waste.

Speakers

Industry experts from the interpack alliance, sustainability consultants, packaging designers, and technology leads from global manufacturing firms.

Demos

Live demonstrations of automated packaging lines, high-speed filling machines, sustainable material testing, and AI-driven quality control systems.

Accessibility

The event is held at the Shanghai New International Expo Centre (SNIEC). From Shanghai Pudong International Airport (PVG), take the Maglev train to Longyang Road Station. From Hongqiao Airport, use Metro Line 2 to Longyang Road. The venue is a short walk or shuttle ride from the station.

Exhibitor Count

900

Expected Attendance

35000

You must be logged in to comment on this event.