Edition 2026

HONG KONG INTERNATIONAL PRINTING AND PACKAGING FAIR 2026

226 vues

Past edition

Date of the event
27 Apr 2026 30 Apr 2026
Hong Kong Convention & Exhibition Centre
1號 Expo Dr, Wan Chai, Hong Kong Island, Hong Kong, Hong Kong, Hong Kong
Frequency
Annual

About the Event

Description

The Hong Kong International Printing and Packaging Fair is a premier global trade platform showcasing the latest innovations in printing and packaging technology, materials, and services. Organized by the Hong Kong Trade Development Council and CIEC Exhibition Company, the fair serves as a vital sourcing hub for industry professionals seeking sustainable solutions, luxury packaging, and digital printing advancements. It features specialized zones such as the World of Advertising and Signs and the Green Printing & Packaging Solutions zone, reflecting the industry's shift toward eco-friendly practices and smart manufacturing.

Exhibits

Digital printing equipment, sustainable packaging materials, luxury packaging, food and beverage packaging, and advertising signage solutions.

Activities

Thematic seminars on industry trends, networking sessions, product demonstrations, and the Hong Kong Print Awards display.

Speakers

Industry experts from global printing associations, sustainability consultants, and leaders in smart packaging technology.

Demos

Live demonstrations of high-speed digital printers, 3D printing applications, and innovative biodegradable packaging machinery.

Accessibility

The event is held at AsiaWorld-Expo. From Hong Kong International Airport, take the Airport Express train for a 2-minute journey. Public buses and cross-border coaches also serve the venue.

Exhibitor Count

450

Expected Attendance

15000

Location

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